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To: ptanner who wrote (49961)	8/5/2001 6:51:17 PM
From: Paul Engel	Read Replies (4) \| Respond to of 275872

Let me correct my throughput numbers - the "20 hour" implant was wrong. It was 20 wafers/day/implanter - or 1.2 Hours/wafer/Implanter. eet.com "Davari said that currently, IBM implants a thin, 3,500-Angstrom layer of oxide beneath a silicon layer of 1,800 Angstrom on a non-epitaxial wafer. IBM developed a proprietary furnace annealing process step, and the result is wafers with defect rates comparable to bulk silicon at "reasonable" throughput in the wafer-creation stage. Shahidi said the slow process of implanting the oxygen—now done internally at IBM at a rate of about 20 wafers per day per implanter—results in an SOI wafer cost of about $400 to $500, compared with about $60 for a bulk silicon 8-inch wafer. The IBM manager said that cost multiple can be reduced to two to four times with higher-throughput equipment. " Note the additional $400 to $500/wafer cost adder for SOI !!