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To: AK2004 who wrote (141067)8/8/2001 1:42:52 AM
From: deibutfeif  Read Replies (1) | Respond to of 186894
 
re: ...secret weapon...

Yeah, here's how it works: they take the partial dice at the edges of the wafer, scribe them so they can be matched up with other partials, and then, using a special trade-secret process, bond them together to get functional devices. Hint - itzy, bitzy bonding machines.

The bigger the die, the more "wasted space" at the edges (that other, less sophisticated, semiconductor companies foolishly just throw away), which can then be used to achieve greater than 100% yield.

~dbf