To: pgerassi who wrote (141581 ) 8/14/2001 5:04:01 PM From: fingolfen Respond to Hey Pete... several problems with your model...Oxygen implantation for thin mode wafers does not cost $6000 to $10000 a wafer (that is what 4X-6X cost would be). Oxygen is cheap and the power required is cheap (no where near $10000 for one wafers worth) thus, the only cost would be for equipment. So you are implying that a production scale implanter(s) doing 30 wafers per hour would cost (30 wafers per hour * $10K a wafer * 8000 hours a year (some downtime for PM) * 1 year life (probably more than that)) $2.4 billion and that is for about 4800 WPW. I doubt the overall cost would be more than a tenth of that or $1K a wafer. The processing costs after that are little changed except for any additional defects caused by the implantation process. I find that rather difficult to see that being very significant due to oxygen is implanted at each level in the wafer to make CPUs. It is used in making the MOSFET gates, isolating components on the wafer and the area between the interconnects and between layers of interconnects. Thus the defect generation cannot be much more than 2 times the defects in any given SiO2 processing step. Suddenly SOI does not look to be that far fetched, now does it?
