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To: brushwud who wrote (51597)	8/17/2001 6:21:48 PM
From: Jim McMannis	Respond to of 275872

Brushwud, Interesting, I just noticed we went to the same school... Jim

To: brushwud who wrote (51597)	8/17/2001 9:34:27 PM
From: Yousef	Respond to of 275872

brushwud, Re: "I think CMP (Chemical Mechanical Planarization) is basically a power-sander to polish the surface of a wafer between adding layers of metal interconnect (wiring)." You are correct ... As the name also implies, there is a chemical etch as well as a mechanical polish in this tool. Thus, the slurry used as well as the pads and down force are very important in determining the across wafer and iso/dense "dishing" uniformity. This operation originally was used for planarizing the oxide layers in the backend (upper layers) interconnect. This has now been extend to polishing the STI (shallow trench isolation), poly and copper interconnect. The real nice thing about CMP is that it also polishes any particulates/defects. Thus, it is inherently a lower defect density process as compared to etching. IBM pioneered this technology and basically gave it to the industry with their membership in Sematech. Make It So, Yousef