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To: Mani1 who wrote (51817)8/20/2001 10:35:32 PM
From: Bill JacksonRespond to of 275872
 
Mani, I wonder if the reason Intel uses a slug is to avoid the heat sink against the die? Why this? Their die is more fragile? thinner? and that means they must protect it from it's own fragility by the use of the slug?? How is the slug attached to the die? low temp solder? or just thermal compound and a pressure fit to avoid exposing the fragile die to heat sink fitting problems. If the die is thinner/more fragile is it to get more heat transfer by replacing silicon with copper as a heat transfer medium. Is this also why they cannot go SOI.
These are speculations.

Bill



To: Mani1 who wrote (51817)8/21/2001 12:32:30 AM
From: wanna_bmwRead Replies (1) | Respond to of 275872
 
Mani, Re: "That is why I was telling you last week that thermal designer design around the TDPmax. But lets not start that all over again."

Thanks again for your descriptions, Mani. I don't want to start anything, but for the benefit of making it clear to everyone, can you please explain why Intel, and now AMD, have decided to ditch the TDPmax number, and have settled on only advertising the TDPtyp value?

wanna_bmw


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