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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Ian@SI who wrote (50997)	8/22/2001 4:39:31 PM
From: Proud_Infidel	Respond to of 70976

TSMC ramping 300-mm wafer fab By Mike Clendenin EE Times (08/22/01 11:58 a.m. EST) TAIPEI, Taiwan — The first 300-mm wafers for customers have rolled off the line at Taiwan Semiconductor Manufacturing Co. Ltd.'s newest fabrication facility in the Hsinchu Science Park, marking the first successful production at the company's full-scale 300-mm fab. TSMC's Fab 12 is using 0.15-micron technology to make 8-Mbit SRAMs for Etron Technology Inc. Company officials said the fab is also producing logic chips as well as SRAM test chips for internal evaluation. Yields are high compared to 200-mm wafers, the company said, but further details weren't provided. TSMC started pilot production on 300-mm wafers last year at its Fab 6, which includes 200-mm and 300-mm lines at its Tainan Science Park location. The company said its good results with 0.15-micron technology means it will now concentrate on using a 0.13-micron all-copper process for 300-mm wafers. Its goal is to produce 4,500 wafers per month by the end of the year. The potential capacity of Fab 12 is 25,000 300-mm wafers per month.