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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Sam Citron who wrote (53390)	9/28/2001 3:06:13 PM
From: Proud_Infidel	Respond to of 70976

Elpida delays 300-mm fab production by 10 months or more Semiconductor Business News (09/28/01 11:07 a.m. EST) TOKYO -- Japanese DRAM maker Elpida Memory Inc. here today announced that it has delayed the chip production in its 300-mm wafer fab by at least nine months, due to the continued downturn in the IC market and other factors. Elpida--the joint DRAM venture between Hitachi Ltd. and NEC Corp.--was originally supposed to install the equipment in the 300-mm fab in Hiroshima by December of 2001. Now, the Tokyo-based company will not install the equipment until September of 2002. The delay will impact the company's chip production schedule. It was originally scheduled to move into pilot production by year's end, with the first silicon expected to be rolling out of the plant in April 2002 (see July 24 story ). Now, it appears that Elpida's 300-mm fab will not move into production until January of 2003, which is about nine or ten months later than originally projected, according to analysts. Officials from Elpida insisted that it has not scrapped the 300-mm fab. But the company had to delay the opening of the plant "due to the unprecedented continued worsening of conditions in the DRAM market, and added to by the inability to read future conditions due to the recent terrorist attack on the United States of America," according to Elpida. Elpida was established in December of 1999 as a joint venture DRAM company between NEC and Hitachi, bringing togetherthe engineering skills of both companies at Elpida's Development and Device Center in Sagamihara City, Kanagawa Prefecture. The company has approximately 450 engineers working on development and design of DRAM devices based on a leading edge 0.13-micron technology.