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To: The Duke of URLĀ© who wrote (144868)10/8/2001 1:28:28 AM
From: wanna_bmw  Read Replies (3) | Respond to of 186894
 
Duke, here are a couple more quotes that I feel need to be reiterated.

And any solution will have to be cheap.

"We can deliver a lot of cool technology in the lab, (but) it's really irrelevant unless you can scale it to millions of units at a low cost," he said.


That's a major point here, and one needs to underscore it several times. This technology is at the point of being used inexpensively in high volumes, and it's soon availability is quite exciting.

As a result, packaging research ranks up with the company's work on Extreme Ultraviolet (EUV) lithography, copper interconnects and transistor speed, Banerjee said. A total of 900 engineers at four different sites are working on package issues, he added.

This suggests we'll be seeing even more advancements in the future. AMD doesn't have 900 employees to put towards an area of research such as packaging. One wonders how long their ceramic and fiberglass flip chip packages will last them.

wanna_bmw