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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (54260)	10/18/2001 10:50:16 AM
From: Proud_Infidel	Read Replies (1) \| Respond to of 70976

TSMC Chairman Talks of 'EFoundry' Strategy at ISSM October 18, 2001 (SAN JOSE, Calif.) -- Morris Chang, founding chairman of Taiwan Semiconductor Manufacturing Co., Ltd., in a speech on Oct. 10 spoke about the future role of silicon foundries. He spoke at the "10th International Symposium on Semiconductor Manufacturing (ISSM 2001)." The conference was held from Oct. 7-10, in San Jose, Calif. The contents of his speech are as follows. TSMC aims to provide the wide range of silicon services, called "eFoundry," from LSI design to the downstream process of LSI manufacturing. Using the eFoundry services, the user feels as convenient as if the user's LSI manufacturing facilities were just next door to the user's plant. Once a user orders LSI design and production to an eFoundry over the Web, the user can investigate all its in-process wafer products at every stage of the process, and can change the LSI design contents on an engineer's desk. Looking back over TSMC's history, Morris Chang said, in the 10 years from 1987, the company had been through the age of "Cost Focus," in which TSMC had concentrated all its efforts on how to reduce the processing cost. From 1997-2001, the age of "Performance Focus" concentrated on how to make progress in device characteristics. From now on, Morris Chang said that TSMC aims to strengthen "Solution Focus," in which TSMC will concentrate on providing the system solutions to the clients by means of realizing system LSIs. TSMC had been in pursuit of the most advanced semiconductor process technologies during the age of the 0.35-0.25-micron process rule. But in the age of the 0.16-0.13-micron process rule, TSMC had taken the position of world leader, and in the stage of a transition to the 300mm wafer process TSMC has also been playing a leading role. In the case of 0.18-micron manufacturing, the yields of 300mm wafer processing exceeded those of 200mm wafers in the second quarter of 2001. It is expected to adopt the 0.15-micron process in the beginning of 2002 and the 0.13-micron process in the second quarter of 2002. As for the introduction of the local cleaning technology (mini-environment technology) to its volume manufacturing facilities, TSMC also has been a world leader manufacturer, Chang said. As shown above, TSMC has been showing manufacturing excellence in the LSI industry. TSMC intends to keep contributing to the user plants to lower the risks of the semiconductor facility investments for them. Related link: ISSM's Web site Related stories: - TSMC May Win 60 Pct. of Global Market Share in Q3 - Taiwan's LSI Industry: Full Operations for DRAMs, 50 Pct. for Logic LSIs - TSMC Moves into China (Nikkei Microdevices)