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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: robert b furman who wrote (136)	10/29/2001 3:32:45 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 25522

Samsung's DRAMs move into mass production in initial 300-mm fab Semiconductor Business News (10/29/01 15:18 p.m. EST) SEOUL -- Hoping to extend its lead in DRAMs and other chip products, South Korea's Samsung Electronics Co. Ltd. here today announced that it has begun mass production in its initial 300-mm wafer fab. The Korean memory giant has begun producing 512-megabit, double-data-rate (DDR) SDRAMs in the 300-mm, 0.12-micron fab, which is located in the Hwasung Industrial complex here, according to Samsung, the world's largest DRAM maker. The move towards 300-mm production is aimed to boost the company's competitiveness and leadership in the memory markets. In general, a 300-mm wafer line has 2.5 times the capacity of an 8-inch (200-mm) plant, paving the way for lower production costs. It is also designed to propel the Samsung into the world's second largest chip maker by 2005, with worldwide sales of $20 billion, said Chang-Gyu Hwang, president of Samsung's Memory Division. "Our semiconductor operations will achieve annual sales of $20 billion in 2005 by diversifying our memory product portfolio and maximizing our competitiveness," Hwang said. "We are nowapplying 300-mm wafers to our memory chip mass production and have begun mass-producing 512-megabit DRAMs to upgrade our lineup and satisfy demand for higher-capacity memory products," he said. In July, Samsung started up the test operations within the 300-mm wafer line, and by September, the first commercial products were coming off the line, according to the company. By 2003, Samsung will move its 300-mm fabs to the 100-nm (0.10-micron) node. It will produce 512-Mbit DRAMs and other products.