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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?

To: robert b furman who wrote (183)	10/31/2001 7:38:12 AM
From: Proud_Infidel	Respond to of 25522

Bob/All, Intel does not reveal 2002 CapEx, but plans to accelerate 0.09-micron chip efforts By Semiconductor Business News Oct 30, 2001 (4:23 PM) URL: siliconstrategies.com SANTA CLARA, Calif. -- Executives from Intel Corp. here today did not reveal the company's capital spending plans for 2002, but noted it will accelerate the development of its next-generation, 90-nm (0.09-micron) process technology. During a Web cast event here today, Craig Barrett, president and chief executive of Intel, said the company plans to unveil its 0.09-micron process technology by "early-2003." Barrett also dropped hints that the company would roll out 0.09-micron chips as early as the "first quarter of 2003." Previously, the company said it would develop this technology by 2003, but declined to be specific about those plans. Intel calls its 90-nm process as P862 and P1262. The P862 process is based on 8-inch wafers, while P1262 is built around 300-mm substrates. The process is based on copper-interconnects, low-k dielectrics, and other features. At present, the Santa Clara-based chip giant is still ramping up its microprocessors and other chip lines, based on 0.13-micron process technology. During the Web cast, Barrett insisted that the company would meet its previously-stated plan to spend $7.5 billion in terms of capital expenditures for 2001. He gave no indication of the company's capital spending plans for 2002. But an Intel executive recently told the Asian Wall Street Journal that the company's capital spending for 2002 would be 10-20% below that of 2001. IC Insights Inc. believes that Intel's capital spending could fall to $4.5 billion in 2002.

To: robert b furman who wrote (183)	10/31/2001 8:13:00 AM
From: Proud_Infidel	Respond to of 25522

Applied Materials Awarded Two Additional Patents for Low k Dielectric Technology Extensive Patent Portfolio Strengthens Applied Materials' Leadership in Low k Technology SANTA CLARA, Calif.--(BUSINESS WIRE)--Oct. 31, 2001-- Applied Materials, Inc. (Nasdaq:AMAT - news) today announced the grant of patents No. 6,287,990 and No. 6,303,523 by the U.S. Patent & Trademark Office covering advanced low k dielectric CVD (chemical vapor deposition) film technology used to increase the speed and performance of next-generation chips. To date, Applied Materials has been awarded more than 15 CVD low k-related patents that enhance its powerful patent portfolio in this strategic technology area. ``These new patents cover some of our most important intellectual property regarding low k dielectric films,'' said Dr. Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Business Group. ``They protect our Black Diamond(TM) technology and demonstrate our leadership in providing customers with innovations to meet their next-generation chip design requirements.'' Issued in September and October 2001, both patents center on Applied Materials' Black Diamond technology, a family of organosilicate glass-based low k dielectric products. Introduced in November 1998, Black Diamond enables chipmakers to cost-effectively integrate a low k dielectric (k less than 3.0) using conventional CVD equipment and silicon-based materials. Black Diamond can be used with Applied Materials' BLOk(TM) dielectric CVD barrier and etch stop film to further lower the overall k value of chip interconnect structures. Black Diamond technology has achieved growing global acceptance, with 17 chipmakers working with it in development. The product line's first film, targeting 0.13-0.10 micron devices, is the industry's leading production-worthy low k dielectric material and has demonstrated the unique capability to be used on every level for 8-level copper interconnects. Customers are expected to ship chips that integrate Black Diamond in 2002. Applied Materials (Nasdaq:AMAT - news), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is www.appliedmaterials.com.

To: robert b furman who wrote (183)	10/31/2001 12:50:34 PM
From: Joe S Pack	Read Replies (2) \| Respond to of 25522

Off topic: Today US treasury canned 30 year notes program which was started in 1977 claiming that US no longer needs such an instrument to finance its operations. I am wondering what implications it will have on 30 year mortgages in specific and mortgage rates in general? Any link or analysis will be greatly appreciated. Thanks in advance, -Nat