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Technology Stocks : Corning Incorporated (GLW) -- Ignore unavailable to you. Want to Upgrade?

To: AV8R who wrote (1525)	11/1/2001 8:06:11 AM
From: Proud_Infidel	Respond to of 2260

Dow Corning Z3MS Receives Editors' Choice Best Product Award Semiconductor International's Designation Recognizes Semiconductor Manufacturing Excellence MIDLAND, Mich., Nov. 1 /PRNewswire/ -- Dow Corning Corp. received Semiconductor International magazine's Editors' Choice Best Product Award for Dow Corning® Z3MS(TM) CVD Precursor, a versatile, high performance precursor designed for a variety of applications. The annual award showcases products that are truly making a difference in semiconductor manufacturing. ``This designation reinforces our ongoing commitment to provide customers with innovative, award-winning products,'' said John Trapani, CVD product market leader, Dow Corning's Semiconductor Fabrication Materials business unit. ``The success of Z3MS is a direct result of our dedicated and intense efforts to develop leading-edge materials for new applications as well as our heavy investment in R&D.'' Compatible with copper damascene and aluminum metallurgy, Z3MS is proving to be a flexible and extendible CVD precursor in a variety of applications. Low-k films deposited from Z3MS offer a dielectric constant of 2.7 and below. In addition, Z3MS can be used to deposit silicon carbide films with a dielectric constant <5.0 for use in ILD, passivation, and other novel applications in both silicon and compound semiconductor fabrication industries. Applied Materials has qualified Z3MS for use in its BLOk(TM) and Black Diamond(TM) processes. The precursor also is the material of choice in AMD's copper, dual-damascene process. With significant advantages over existing SiH4 and TEOS-based CVD, Z3MS is an excellent choice for manufacturers using high-performance interconnect processes. ``The Editors' Choice Best Products program differs from other awards in that products must be nominated by users, not by people who make or sell them. We receive input from multiple users for each product to verify that each has successfully shown superior performance in semiconductor manufacturing,'' noted Pete Singer, editor in chief, Semiconductor International. About Semiconductor International Semiconductor International, published by Cahners Business Information and a part of Reed Elsevier's global array of technical publications, is the leading technical publication reaching and covering the global semiconductor industry. SI boasts the industry's most experienced full-time technical editorial team, and has the largest circulation to semiconductor manufacturers of any industry publication. Additional information about SI and its many products and activities is available at www.semiconductor.net . About Dow Corning's Semiconductor Fabrication Materials Dow Corning's Semiconductor Fabrication Materials unit provides both spin-on and CVD low-k dielectric solutions for current and next generation semiconductor devices. For more information about how Dow Corning is leading the way to ultra-low-k, visit lowkleader.com . About Dow Corning Dow Corning Corporation (http://www.dowcorning.com ), which develops, manufactures and markets diverse silicon-based products, currently offers more than 10,000 products to customers around the world. Dow Corning is a global leader in silicon-based materials with shares equally owned by The Dow Chemical Company (NYSE: DOW - news) and Corning Incorporated (NYSE: GLW - news). More than half of Dow Corning's sales are outside the United States. For product information, contact: For editorial assistance, contact: Dow Corning Corporation Cynthia Pang Customer Service Dept. Phone: (206) 239-0108 P.O. Box 0994 E-mail: cpang@apcoworldwide.com Midland, Mich. 48686-0994 Phone: (989) 496-6000 Toll-free: (800) 346-9882 FAX: (989) 496-4586 Web site: dowcorning.com Ref. no.: P1175 Dow Corning is a registered trademark of Dow Corning Corp. Z3MS is a trademark of Dow Corning Corp. SOURCE: Dow Corning Corporation

To: AV8R who wrote (1525)	11/7/2001 3:07:02 PM
From: Proud_Infidel	Respond to of 2260

Corning to produce ultra-high transmission ArF-grade glass for 193-nm tools Semiconductor Business News (11/07/01 14:17 p.m. EST) CORNING, N.Y.-- Corning Inc. today announced plans to produce ultra-high transmission ArF-grade fused silica glass for lenses used in 193-nm argon-fluoride lithography tools. The company here said it has developed improved processes for the glass and it has installed a pilot furnace in its Charleston, S.C., manufacturing facility to produce the material. "When this process is implemented, we will be capable of providing our customers with the highest quality fused silica available for microlithography applications," said Jim Steiner, vice president and general manager for Corning Specialty Materials. "Corning materials already have low birefringence and good homogeneity properties. The addition of high transmission to our ArF-grade fused silica will help our customers move forward with the next generation of technology," he added. Corning said it expects the manufacturing process to be implemented in the fourth quarter this year. Corning's ultra-high transmission ArF-grade HPFS glass material is now scheduled to become available to customers in the first quarter of 2002.

To: AV8R who wrote (1525)	11/8/2001 10:23:46 AM
From: Proud_Infidel	Read Replies (1) \| Respond to of 2260

Corning Incorporated Announces Plan for Convertible Debentures Offering CORNING, N.Y.--(BUSINESS WIRE)--Nov. 8, 2001--Corning Incorporated (NYSE:GLW - news) today announced that it has commenced a public offering of $600 million aggregate principal amount of senior unsecured convertible debentures under its existing $5 billion universal shelf registration statement. The debentures are expected to have a 7-year maturity, due in November 2008 and are redeemable at Corning's option after November 2004. The sole bookrunning manager will be Goldman, Sachs & Co. Net proceeds from the offering will be used for general corporate purposes, including working capital requirements, normal, ongoing capital spending, and the possible funding of future acquisitions. This represents a new financing by Corning. This offering is made by means of a prospectus supplement to a prospectus that is part of Corning's universal shelf registration statement previously filed with the U.S. Securities and Exchange Commission and declared effective in March 2001. For a copy of the prospectus and prospectus supplement relating to this offering, contact the prospectus department of Goldman, Sachs & Co., 85 Broad Street, New York, NY 10004, Telephone: (212) 902-1171. This news release shall not constitute an offer to sell, or the solicitation of an offer to buy, nor shall there be any sale of these securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the securities laws of any such jurisdiction. Established in 1851, Corning Incorporated creates leading-edge technologies for the fastest-growing markets of the world's economy. Corning manufactures optical fiber, cable and photonic products for the telecommunications industry; and high-performance displays and components for television, information technology and other communications-related industries. The company also uses advanced materials to manufacture products for scientific, semiconductor and environmental markets. --------------------------------------------------------------------------------