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To: fingolfen who wrote (146465)	10/31/2001 3:05:06 PM
From: AK2004	Respond to of 186894

fingolfen like I already said, they may not have a clue yet they affect the market

To: fingolfen who wrote (146465)	10/31/2001 3:37:16 PM
From: Dan3	Read Replies (1) \| Respond to of 186894

Re: never promised more than 30% cost reduction from 300mm. It sounds like someone at JJ added the 50% cost reduction expected from the shrink from .18 to .13 and less costly packaging to the 30% cost reduction expected for 300mm - which, of course, is the wrong way to do it. They should have multiplied .5 x .7 to get a cost of 35%, which is only a 65% expected reduction in costs, not 80%. The fact that they're now forecasting a 25% reduction instead of a 65% reduction is surprising - perhaps they're taking into account the more than doubling of the size of their average die (on a given process) due to architectural changes in the processor lines. Could they mean that a .13 P4 on 300mm wafers with less expensive packaging and automated wafer handling will cost 25% less than a .18 PIII using the old-style, expensive, packaging and wafer transport "by hand?"