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To: wanna_bmw who wrote (62565)11/7/2001 12:07:44 PM
From: combjellyRead Replies (1) | Respond to of 275872
 
"That would depend on who's manufacturing it."

Yes, it would. It would also depend on what the desired bin splits are and a whole pot of other factors. But, there is some ballpark figure for what is expected given a particular die size.

Assuming that Itanium is 300mm^2 or so, that is a maximum of around 100 die per wafer on an 8 inch wafer. Now there is no way that it will map to cover 100% of the wafer surface, so what? 75 max? And we haven't even begun to estimate the costs of those L3 cache chips...