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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Paul Engel who wrote (148008)	11/14/2001 2:14:29 AM
From: Joseph Pareti	Read Replies (2) \| Respond to of 186894

Intel Powers Down for Latest Server Push Source: Computergram International Date: November 14, 2001 Number: 4294 Intel Corp delivered on the first step of its low-power server blueprint yesterday, repackaging technology from its mobile products division, but saying it will be next year before it delivers "differentiated" technology including dual processing and advanced I/O. As expected, the Santa Clara, California-based chip giant has raided its mobile division and is targeting builders of low power, hyper-dense systems, with an Ultra Low Voltage Pentium III processor running at 700MHz and its 440GX chipset. Both building blocks are standard parts available from Intel's mobile products business, the only difference being the omission of the M, for mobile, from the processor's name. The core processor runs in the 1.1v range, while both the processor and chipset are surface mounted, which offers a much lower profile, making them better suited to hyper-dense server blades where space is at a premium. However, the vendor said that the first quarter of 2002 will see the release of more differentiated products aimed at developers of hyper-dense servers. These will include dual processing versions of the ultra low voltage Pentium III and support for the advanced I/O standards demanded by servers. However, Shannon Poulin, enterprise marketing manager at Intel, insisted that the existing package already give Intel an edge over its main competition in this market, Transmeta's Crusoe line. Poulin said Intel is the only chip company marketing a low-power combination that supports ECC memory and addresses 2GB of memory. These were "check off items" in the server market. Intel's edge would be further sharpened, he claimed, with the release of the more differentiated products next year. Although Intel already has dual processing in its Pentium III range with Xeon processors, the dual processing offering to be launched next year will continue to be derived from Intel's mobile technology, said Poulin. The company is currently designing in dual processor capability into the ultra-low voltage Pentium III M platform, he said. As far as advanced I/O support is concerned, the company has not revealed what standards it will support, although it is looking at PCI, PCI-X and the different backplanes used in the server market. The company is unlikely to exploit its Pentium 4 platform to target the low-power market, said Poulin. Rather it will march in step with Intel's mobile technology development strategy as it moves from Pentium III to the Banias platform, due in 2003, which will offer additional power-saving technology. Compaq and Intel announced an alliance to develop products for the hyper-dense server in May. Compaq's role in yesterday's announcement seemed pretty low-key, although Poulin said the PC vendor has been involved in the validation of the package in servers and added that Compaq, along with Tatung, HP and Dell have announced plans to exploit the technology. He said Compaq's role would be more important in the development of the upcoming technology. Return to Index