To: Jerome who wrote (474 ) 11/14/2001 9:27:30 AM From: Proud_Infidel Respond to of 25522 Korea's Dongbu quickly prepares 0.18-micron for foundry production Semiconductor Business News (11/14/01 08:47 a.m. EST) SEOUL -- Dongbu Electronics Co. Ltd. today announced it has qualified a low-voltage 0.18-micron logic technology for silicon foundry products about seven months after ramping its first 0.25-micron process into volume production at a new 200-mm wafer fab in Eumsung, South Korea. The Korean foundry startup said its new DL018LVT 0.18-micron CMOS process has demonstrated high yields after more than 1,000 hours of burn-in testing. The technology is expected to be used by foundry customers for system-on-chip (SoC) designs targeted at wireless, portable, and advanced consumer electronics applications, said Dongbu. Like Dongbu's initial 0.25-micron process, DL018LVT is based on technology licensed from Toshiba Corp. The Japanese chip giant has invested about $50 million in Dongbu and licensed rights to design libraries and process technologies for 0.25-, 0.18, and 0.13-micron ICs in return for a portion of the foundry's capacity (see July 3, 2000, story). Dongbu is also offering an internally developed "foundry compatible" 0.25-micron process, which the company says is similar to technologies from larger suppliers, such as Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). The new logic process "places Dongbu solidly in the middle of the 0.18-micron design window, offering a new source of supply as the worldwide demand for 0.18-micron wafers continues to expand, " said Peter Hillen, executive vice president of worldwide business development based in Mountain View, Calif. The 0.18-micron logic process offers up to six layers of metal for connectivity, and it uses shallow trench isolation structures to optimize chip density and transistor characteristics, said Dongbu. The process also supports 1.5-volt operation. Dongbu said the DL018LVT logic process will be foundation for a mixed-signal version of the technology, called DL018MST, which will be released next month and include PIP capacitors for implementing precision analog circuits. Dongbu also said it expects to complete qualification of a standard "foundry-compatible" 0.18-micron process (DL018GD) within the next few weeks. This process will be similar to the DL018LVT technology but it will offer voltage ranges of 1.8-to-3.3-V range. Prototyping services are also available for the 0.18-micron process using Dongbu's ShuttleChip multi-project wafers, which packs multiple designs on a single 200-mm substrate.