To: Charles Gryba who wrote (148182 ) 11/14/2001 5:19:57 PM From: wanna_bmw Read Replies (3) | Respond to of 186894 Constantine, Re: "What was the cooling on that 3.5Ghz P4? What other enhancements did it have?" Some speculate that it was highly chilled, though the exact cooling method is unknown. With an internal goal of 3.0GHz before the end of 2002, I don't doubt that Intel can get close to an air cooled 3.5GHz Pentium 4 with .13u manufacturing. Of course, by the middle of 2003, Intel is already set to start their ramp on .09u manufacturing, which will offer an even greater boost to performance. I thought it was funny when AMD's slides had .09u manufacturing on them, because clearly that was added at the last minute to compete with what Intel had. Even their slides were inconsistent, with some slides still referring to .10u manufacturing. I think it may get more difficult for AMD to keep up, manufacturing wise. They are still showing signs of lateness with their .13u SOI process. If you didn't catch the recent press release, AMD is planning on purchasing wafers with SOI already built into them to align with Hammer tapeout. This clearly indicates that AMD does not have any confidence in their SOI process yet. Another clear indication of AMD slipping are some Thoroughbred pictures from HardOCP that indicated that the chip itself was not operational. I would expect hardware samples to be operational by now. If Thoroughbred is just a shrink of Palomino, you can almost assume that it's not the design causing the failure, but the manufacturing process. With all that AMD has left to do before they are operational with .13u, let alone SOI, do you think they are in a good position to bypass .10u manufacturing, and shoot to .09u, just to compete with Intel? BTW, sorry for the digression, but I thought this was interesting. wbmw