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Technology Stocks : Applied Materials No-Politics Thread (AMAT) -- Ignore unavailable to you. Want to Upgrade?


To: Jerome who wrote (539)11/15/2001 9:14:02 AM
From: Proud_Infidel  Respond to of 25522
 
Analog Devices Using Epi Systems From Applied Materials to Build Fast Silicon and SiGe Bipolar Chips
Epi Centura® Systems Enable Si and SiGe Bipolar Technologies to Move From R&D to Production
SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 15, 2001-- Applied Materials, Inc. (Nasdaq:AMAT - news), the leading provider of epitaxial (epi) deposition technology to the semiconductor industry, has installed its Epi Centura systems at Analog Devices' fabs in Massachusetts and California, where they are being used for next-generation bipolar device production using silicon (Si) and silicon germanium (SiGe) technologies.

Silicon germanium is a key material that enables the fabrication of high frequency, low power chips. One of the most common applications for SiGe is in the formation of heterojunction bipolar transistors, where a small amount of germanium is added to the base of a silicon bipolar device to overcome fundamental gain, speed, and resistance trade-offs in silicon transistors.

Brad Scharf, division fellow and manager of Process Development at Analog Devices' fab in Wilmington, Massachusetts, said, ``Our early involvement with SiGe heterojunction transistors with epitaxial bases demonstrated the value of that technology for high-speed mixed-signal applications. After a thorough investigation of different CVD and UHV-CVD SiGe technologies, we chose the Epi Centura for its excellence in productivity, throughput, profile control, and process uniformity. The flexibility of the multi-chamber system and the applications expertise demonstrated by Applied Materials were also positive factors. This system meets all of our requirements for both Si and SiGe production today, and for several future device generations.''

``This multi-system installation at a bipolar process leader like Analog Devices shows our market momentum for both new and sustaining epi technologies,'' stated Per-Ove Hansson, general manager of the Epi Substrate Division at Applied Materials. ``We have added many new features to the Epi Centura for advanced epi processing, including automated setup of complex germanium profiles, integrated preclean, and integrated metrology that will help our customers meet both current and future epi processing needs.''

Applied Materials (Nasdaq:AMAT - news), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is appliedmaterials.com.



To: Jerome who wrote (539)11/15/2001 11:01:17 AM
From: Proud_Infidel  Respond to of 25522
 
Applied believes it could be February before recovery signs are clear

Fab tool giant braces for another drop in revenues and potential loss in current quarter
By J. Robert Lineback
Semiconductor Business News
(11/15/01 09:22 a.m. EST)

SANTA CLARA, Calif. -- For at least the next several months, Applied Materials Inc. is prepared to hunker down as it waits for clear signs of an end to the downturn in semiconductor capital spending. The world's largest supplier of chip-making tools now believes its revenues will fall another 20% sequentially in the current fiscal quarter partly because semiconductor executives remain uncertain about economic conditions and the potential for recovery in IC demand next year.

"We believe this lack of visibility [caused by the Sept. 11 terrorist attacks in the United States], added to an already slowing economy, has postponed a recovery in the semiconductor industry," said Joseph R. Bronson, executive vice president and chief financial officer of Applied Materials. Speaking to financial analysts during a conference call on Wednesday, Bronson said the company has downgraded its projections for chip industry revenues and capital spending because of greater uncertainty and weak conditions in the final months of 2001.

"This is the first downturn in history where both unit volumes and dollars have declined for both memory and logic chips," said Bronson in the conference call after Applied reported a 20% sequential drop in net sales to $1.26 billion in the last fiscal quarter, ended Oct. 28. "We now estimate capital spending for 2001 to be down by over 30% [from a previous estimate of 27%] and wafer fabrication equipment spending down close to 35% [from a previous forecast of 30%].

"We expect capital spending to remain weak in the first half of 2002 due to continued wafer fab under utilization and poor customer profitability," added the CFO.

As a result of near-term weakness, Applied is expecting its own revenues to drop slightly more than 20% in the current fiscal quarter to around $1 billion from the prior three-month period. Bronson said bookings are expected to be flat to slightly lower than $1.1 billion in new orders received by the company in its fiscal fourth quarter, which ended Oct. 28. New orders fell 9% in the last quarter, which was greater than expected due to delays and cancellations of 300-mm tool purchases, Bronson said.

Applied's results were slightly lower than estimates on Wall Street, with the company posting a net loss of $82 million in the quarter, including pre-tax restructuring charges for layoffs announced two months ago. Excluding one-time charges and other items, Applied said its net income was $22 million, or $0.03 per diluted share, which was one cent per share less than Wall Street's consensus, according to First Call/Thomson Financial (see Nov. 14 story).

During Wednesday's conference call, Applied executives declined to give estimates on market growth for 2002. However, the company is currently expecting to see a recovery in tool-purchase "commitments" in the second half of next year as wafer fab utilization improves worldwide and demand for 300-mm production systems begins to grow again, Bronson said.

Currently, Applied is estimating that the chip industry will purchase about $6 billion worth of 300-mm systems in 2001, which is down from a forecast in the summer of $10.2 billion but in line with the outlook at the start of this year. Bronson said Applied expects chip makers to purchase $11 billion in 300-mm (12-inch) wafer tools in 2002.

"A number of 300-mm projects scheduled for early 2002 have been pushed out by those customers that have not been early adopters of 300-mm," Bronson told analysts. "We believe those customers that have 300-mm pilot lines are going ahead with production at the current time."

In another key technology segment, copper-deposition tool shipments are expected to grow 30% in 2002 to $1 billion, up from $700 million in 2001, according to Bronson.

Looking ahead, Bronson said Applied expects to "remain profitable or incur a small loss" with net sales of $1 billion in the current fiscal first quarter, which ends in late January.

"We will do what we need to do not to lose money, but we have to account for any revenue uncertainty," Bronson said when asked if the company was now willing to become unprofitable for one quarter in order to maintain its resources for the eventual upturn. "It was tough to get the breakeven level to $1.1 [billion in sales], and we achieved that, and now we are trying to take the breakeven point lower than $1.1 [billion], which I think we have achieved, but I think we have to hold some small probability [of a loss]."

Applied chairman and CEO James C. Morgan quickly added that the Santa Clara company will not compromise strategic investments in new technologies and tools while trying to reduce costs in the current fiscal quarter. "We have more opportunities than we can get our arms around," Morgan said. He added that continued investments in future concepts for wafer fabs will continue in order to make sure that Applied remains "the leader for the next decade," and "that may impact our profitability," said the chief executive.

A major problem facing the industry in the next year is the lack of leading-edge fab capacity and continued delays in investments as a result of uncertainty in the marketplace, Morgan warned. He said many chip manufacturers are now at the crossroads and must make decisions on adding new leading-edge capacity for 0.13-micron and below process generations.

Morgan estimated that only 4% of the industry's current capacity is capable of producing 0.13-micron and below devices. When demand finally takes off, the need for new fab equipment will "go vertical," Morgan warned, expressing concern about the industry's ability to make those investments in a timely fashion for the next growth cycle.

Semiconductor executives "are really at a cross point for decision-making," Morgan said. "The problem is we cannot get them to commit to when they will sign the purchase orders. There are a lot of potential purchase orders out there, but I think we won't know until the February timeframe or the early part of next year what they are going to do," he said.



To: Jerome who wrote (539)11/15/2001 9:10:51 PM
From: Proud_Infidel  Read Replies (1) | Respond to of 25522
 
IC researchers integrate more than transistors

By Nicolas Mokhoff
EE Times
(11/15/01 19:07 p.m. EST)

MANHASSET, N.Y. — As microelectronics fabrication techniques allow more than transistors to occupy a piece of silicon, engineers are integrating components from the worlds of biology, chemistry and physics on chips as well. Technical papers that detail novel approaches to this continuing integration phenomenon will highlight next month's International Electron Devices meeting (IEDM) in Washington.

Researchers from the Microelectronics Institute (Athens, Greece), for example, will discuss enabling technologies for developing optical biochips whose results can be read without external optical components. The novel optical transducer consists of light sources, optical fibers and detectors that are monolithically integrated on an IC.

Unlike existing optical biochips that are made on quartz or glass slides and that require epifluorescence or confocal microscopy to read results, this chip requires only a standard electrical signal readout. This development heralds all sorts of possibilities for point-of-use determinations and real-time in vitro and in vivo multianalyte detection, according to the researchers.

Meanwhile, researchers at Duke University (Durham, N.C.) will discuss their Mist technology concept. This metal-insulator solution transport device is a potential enabling technology for high-throughput methods in synthetic and analytical chemistry and biochemistry that require rapid, automatic handling of minute quantities of liquids. The ultralow-power microfluidic device is applied in integrated biomicroelectrofluidic systems (Bio-MEFS).

According to the researchers, the device is the MEFS equivalent of a MOSFET. Like the MOSFET, the Mist exhibits bilateral transport of fluids rather than electrons, is electrically isolated, uses a gate electrode for charge-controlled transport, has a high threshold voltage and is a square-law device, the researchers say.

The presenters will detail a Mist device model with its characterization data, and show how when integrated, it can enable the development of large-scale biofluidic systems, such as reconfigurable biosensors or microchemical synthesizing. Simulations show that the Mist chip offers certain advantages over pressure-driven continuous flow technology: It has double the throughput, is 200 times smaller in size, and has microwatts power dissipation vs. Watts.

In a more esoteric strand, researchers from the Institute of Microelectronics of Singapore will discuss the technology behind the first microfabricated thermal reactor that can be integrated with other components on an unheated surface. Prior to this development, thermal cycling typically was performed on the entire substrate containing the reaction chamber, which produced a slow thermal response due to the large parasitic thermal mass.

Microfabricated thermal reactors are used to amplify nucleic acids in so-called miniaturized total analysis systems. A novel thermal isolation design has been implemented by etching through a thermally conductive silicon membrane to eliminate thermal crosstalk between reactor and substrate, and to reduce parasitic heat capacitance. The result of this achievement promises to integrate the microreactor with other components in the analysis systems, either on one chip or in a hybrid.

In the far-out realm of using microelectronics with molecular and neurobiology, an invited paper from the department of membrane and neurophysics at the Max Planck Institute for Biochemistry (Martinsreid, Germany) will detail work on linking semiconductors and living cells. This work may lead to sensor chips for pharmaceutical screening, to actuator chips for modulating molecular signals and cellular growth and to neuroelectronic devices for neurocomputation and neuroprosthetics.

One example of the work in neuroprosthetics used large identified neurons from a pond snail to build elementary neuroelectronic devices. A silicon micro-prosthesis chip was created that is able to record neural excitation on voltage-gated ion channels inserted into cells on the chip. Signal recognition and amplification on the chip is used to capacitive stimulate a second disconnected neuron.



To: Jerome who wrote (539)11/16/2001 8:14:40 AM
From: Proud_Infidel  Respond to of 25522
 
International SEMATECH Buys Applied Materials' Reflexion CMP System for 100nm Copper/Low k Development on 300mm Wafers
SANTA CLARA, Calif.--(BUSINESS WIRE)--Nov. 16, 2001--Applied Materials, Inc. has received an order from International SEMATECH for its Reflexion(TM) 300mm CMP (chemical mechanical polishing) system. The system, which was shipped to International SEMATECH in October, will be used to develop advanced copper/low k dielectric interconnect circuitry for 100nm and below chip generations.

Ken Monnig, associate director of Interconnect at International SEMATECH, said, ``We chose the Reflexion based on our experience with Applied Materials' Mirra® CMP system, which we have been using for several years for 200mm copper development. Our plan is to extend this work both to 300mm and to materials with lower dielectric constant, in the range of k less than 2.2.''

The Reflexion system features the latest technology advances in CMP metrology and endpoint capability, and a set of well-developed processes for copper/low k polishing. Integrated Mesa cleaning technology provides single-wafer megasonics with a two-stage brush scrub for low defect performance and high wafer output per square foot. Reflexion offers a variety of advanced process control (APC) options that reduce the need for off-line metrology, and greatly improve planarity and cost of ownership. The Reflexion system's advanced monitoring technologies, such as iScan(TM), which measures remaining film thickness in real time, and FullScan(TM) endpoint detection which reads across the entire surface of the wafer, provide precise control of overpolishing and contribute to higher yields and excellent results on copper-based chips.

``We've worked with International SEMATECH on CMP programs since the mid-1990s, and their contribution to the industry's process knowledge has been extremely valuable,'' noted Dariush Rafinejad, corporate vice president and general manager of Applied Materials' CMP product business group. ``Having the Reflexion system at SEMATECH for 300mm copper/low k development work should provide Applied Materials with an excellent basis for continued system refinement, while offering International SEMATECH's member companies insights into the latest advances in CMP process technology.''

Applied Materials is the market share leader in copper CMP systems for 200mm and 300mm wafers. According to Dataquest, the market for copper CMP technology is expected to grow from $128 million in 2001 to $705 million by 2006. The total market for CMP equipment, estimated to be $1.2 billion in 2001, is forecast to reach $2.6 billion by 2006.

Applied Materials (Nasdaq:AMAT - news), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' Web site is appliedmaterials.com.