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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: milo_morai who wrote (149956)	11/27/2001 10:41:50 PM
From: Dan3	Read Replies (1) \| Respond to of 186894

Uh-Oh.... Intel kills plan to use SVG's 193-nm scanners in production due to delays Chip giant opens up competition for its next-generation lithography tool business By Mark LaPedus Semiconductor Business News (07/31/01 13:42 p.m. EST) SANTA CLARA, Calif. -- Intel Corp. has scrapped its production plans to use 193-nm, argon-fluoride (ArF) lithography tools from Silicon Valley Group Inc. because of delays in tool shipments. The decision, confirmed by an Intel official in an interview with SBN, apparently kills a $100 million tool order. Well, I guess if they have to re-start all their production development from scratch to account for "discovering" that they need SOI, they might as well junk all their development work done towards implementing SVG stepper-scanners. Meanwhile, AMD is ramping the 193nm scanners they've been working with since *1998! EXCELLENT FIRST RESULTS FOR 193NM LITHOGRAPHY PROCESS DEVELOPMENT PROGRAM IMEC-ASML Alliance Attracts Major International Participation Leuven, Belgium, November 18th, 1998 --- The joint IMEC - ASML 193nm process development alliance, formed two years ago, has announced excellent early results from ASML's 193 nm Step & Scan system. ASML's Step & Scan system has demonstrated imaging capabilities for 100 nm research and development. First results indicate that the system is compatible with pilot line production of integrated circuits corresponding to 130 nm device design rule generations and beyond. ASML's Step & Scan system, intended for pilot line production and technology development in preparation for volume production from 2001, will become operational in the first half of next year in a special 193 nm lithography facility adjacent to IMEC's pilot line. Equipment already installed includes an advanced coat and development track (TEL ACT8) with an Extraction Systems' TMB-RTM contamination monitoring system; a top-down CD SEM (the KLA-Tencor 8100-ER); new cross-section and inspection SEMs from Philips (XL30 and XL810); and a KLA-Tencor ASET F5 thin film measurement tool with 193 nm capability. During the past 12 months of preparation, the program has attracted a significant number of industry partners. Semiconductor companies joining the consortium include Advanced Micro Devices, Micron Technology, National Semiconductor, Philips, SELETE, Siemens and Texas Instruments*. In addition, mask shops (Photronics) and equipment suppliers (KLA-Tencor, Lam Research, TEL) have joined. Also resist manufacturers (JSR, OMM) have committed to participate. By pooling their technological resources, all participants will gain early process knowledge at a lower cost than individually-funded R&D work. imec.be