To: Dan3 who wrote (65210 ) 12/8/2001 2:27:18 AM From: peter_luc Read Replies (2) | Respond to of 275872 Dan, thread, can someone comment on this article, please?e-insite.net (Found the link on JC's message board.) "Motorola To Unveil 0.10-Micron Technology Online staff -- Electronic News, 12/3/2001 Motorola Inc. today said it will preview its next-generation 0.10-micron CMOS technology, HiPerMOS 8 (or "HiP8"), and new gate dielectric material this week. Motorola will provide details on its HiP8 platform technology this week at the IEEE International Electron Devices Meeting (IEDM). The technology is expected to complete process certification in December 2002. Motorola, based in Schaumburg, Ill., said HiP8 will allow for a 30 percent reduction in line width over the company’s current HiP7 0.13-micron generation, which in turn will allow for a 50 percent reduction in chip size by increasing gate density and reducing SRAM bitcell area, Motorola said. Motorola expects to manufacture the technology on its fourth generation of copper interconnect. HiP8 supports dual/triple gate oxide, analog, and non-volatile memory modules, the company said, and is also designed to support a range of low power, high performance and silicon on insulator (SOI) applications. The technology is also able to support third party designs and libraries. Motorola also plans to present a paper this week describing the integration of a hafnium oxide gate dielectric into a standard CMOS process. Current leakage is reduced by a factor of 1,000 by switching from silicon dioxide to hafnium oxide, the company said, adding that this development will allow for further shrinking of CMOS devices." Is HiP8 still co-developed by Motorola and AMD? Is this also true for the integration of a hafnium oxide gate dielectric into a standard CMOS process? Would AMD have the right to use this process? Peter