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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: wanna_bmw who wrote (152610)	12/15/2001 7:12:16 AM
From: Dan3	Read Replies (1) \| Respond to of 186894

Wann_bmw, we aren't that far off. Where I used -> I was indicating that the facility is or will be moving to the new size. .18 -> .13 means it's at .18 now but moving to .13. I didn't include D1BR in the total, treating it as a development rather than a production FAB. I excluded FAB7 from the totals. FAB10 and FAB14 don't total to 90,000 sq. ft.: Fab 14 is located in Leixlip, Ireland, just outside of Dublin. The facility is approximately 800,000 square feet, including a 90,000 square foot cleanroom. The company also announced that it will convert Fab 10 (which is next to the new factory) to the 0.25 micron process technology intel.com D1BR may be D1C (going by the sizes listed), in which case it should be removed from the list. But if the electrical work at D1C was completed in 1998, then some of its production potential (like most of AMD's Dresden production potential) should be considered as in place - and I excluded all of D1C from any totals. Intel DIBR - Hillsboro, OR Owner: Intel General Contractor: ADP Marshall Completion Date: 1998 Renovations and a new addition to an existing sub-class 1 clean room totaling 200,000 sq. ft. The project consisted of the supply of high-voltage and low-voltage power, lighting and support systems. The project was completed in 6 months and required 160 electricians at its peak. masselec.com Some of the FABs Intel lists as producing flash, probably don't produce only flash FASL (AMD and Fujitsu combined) produces more flash than Intel. FASL has 185,000 sq. ft. of space while Intel 300,000 to 400,000 sq. ft. (and that doesn't include FAB7). FAB 7 could be used to make chipsets and analog comm parts. Some (or all) of Intel's chipset work is going to sent to foundries next year (when FAB 7 is scheduled to close) and modem chips are getting to be too cheap to be worth Intel's time. The unanswerable (from public data) is how much of Intel's (or AMD's) potentially available CPU/logic FAB space is being used for CPUs, and not being used for embedded processors, networking, comm, or (in AMD's case) as foundry space. FASL, (AMD/Fujitsu combined) produces more flash than Intel. FASL has 185,000 sq. ft. of active FAB space, so I suspect that a good part of the 300,000 to 400,000 sq. ft. of FAB space Intel says is used for making flash, is also used for making networking, embedded, etc. chips. Note that I didn't include any space from FAB 7 (which total may, as you say, consist of FAB7 + FAB4 + FAB5 + ...) and is closing next year. Intel is exiting the consumer space, so that isn't using much FAB space. Most motherboards now include networking, and many include modems, and those products are made by many other companies than AMD and Intel. So I don't think either company is using a lot of FAB space for those products. The same thing is true of networking parts such as switches, hubs, etc. The amount of silicon used by AMD/Intel for such products is much smaller than what is used for CPUs. If you drop "D1BR" from the total Intel is still running up to 1,000,000+ sq. ft. of non-flash FAB space, while AMD is running up to 240,000. I'll stand by my estimate that AMD's FAB space used for CPUs is 160,000 to 180,000 sq. ft and Intel's FAB space in use for CPUs is 600,000 to 800,000 sq. ft.