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To: Bill Jackson who wrote (66609)	12/30/2001 4:48:08 PM
From: semiconeng	Read Replies (2) \| Respond to of 275872

Elmer, I recall reading that traces of copper spreading from various parts of the process by whatever means can cause severe damage to wafers. I expect this is due to the nature of tiny amounts of copper ions 'doping' whatever they touch and diffusing here and there and in essence wrecking the parts. This would mean all the inputs and outputs of whatever process chemicals, dopants, washes etc, would have to be issolated from each other. Possibly in non copper processes there is a lack of this isolation. This means lots of changes to premit the copper process to operate. Possibly someone who knows how and why copper is such a pestiferous material in terms of contamination could make a comment here? Bill The basic rule of thumb is Cu and Non-Cu shall not mix. Period. I heard someone did a test, where they placed a penny on the top surface of an Si Wafer, and they were able to detect Cu particles on the Back surface. I'm not sure of the specific details, but if any Cu gets into the front end of the process, the result is dead die. Mr Roberts says.... the word of the day is...... segregate. Semi