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Technology Stocks : Lam Research (LRCX, NASDAQ): To the Insiders -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (4742)	1/4/2002 7:53:30 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 5867

UMC, Infineon may push out tooling of 300-mm fab in Singapore Semiconductor Business News (01/04/02 19:15 p.m. EST) SINGAPORE -- The tooling of a joint-venture 300-mm wafer fab here between United Microelectronics Corp. and Infineon Technologies AG could be delayed this year because chip markets are flooded with too much capacity, according to a UMC official, quoted by the Reuters news service today. Construction on the joint-venture fab, called UMCi Pte Ltd., began last spring, with 300-mm equipment slated to be installed in the plant during the third quarter of 2002. "We will continue to build the shell [of the fab building] but the original schedule for moving in equipment was third quarter, and we may not be in such a hurry now," the UMC official in Taiwan told Reuters. The official said UMC could decide whether or not to delay the fab's tooling in the second quarter. Under the current schedule, the $3.6 billion facility will begin production in early 2003. When fully equipped, the UMCi fab is expected to reach a capacity of 40,000 twelve-inch (300-mm) wafers per month (see Dec. 14, 2000, story). But soon after the Singapore fab was announced by UMC and Germany's Infineon, the semiconductor industry began to slipped into its worst recession in history and chip markets became flooded with too much capacity. UMC, the world's second largest silicon foundry, reported that its factories were operating at only 36% of installed capacity during the third quarter of 2001. The company posted a net loss of about $118 million in the period on revenues of $444 million.