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To: Robert Salasidis who wrote (154008)1/6/2002 1:18:57 PM
From: Joseph Pareti  Read Replies (1) | Respond to of 186894
 
re The difference between 8" and 12" wafers (200 and 300mm) is more like 125% more not 25% as stated in the article.

What the actual cost per die is (taking into account the higher wafer costs) is another matter

25% is in full agreement with Paul O's forecasted cost saving as a result of 130 nm and 300 mm. Hector, in contrast topped the forecast with 40% (which is, however, *just* on his powerpoint slide)


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