To: SemiBull who wrote (3695 ) 1/23/2002 7:42:13 PM From: SemiBull Read Replies (1) | Respond to of 3736 European Device Manufacturer Expands SpeedFam-IPEC CMP Equipment Portfolio with Momentum Technology 200-mm Orbital Hard-Platen System to Enable Advanced Oxide and Tungsten Process Development CHANDLER, Ariz.--(BUSINESS WIRE)--Jan. 23, 2002-- SpeedFam-IPEC, Inc. (Nasdaq:SFAM - news), a global supplier of leading-edge chemical mechanical planarization (CMP) systems for advanced semiconductor manufacturing, has announced that a 200-mm Momentum(TM) CMP tool is being evaluated by a top-10 device manufacturing group with headquarters in Europe. This evaluation is in addition to the 300-mm Momentum evaluation within the same manufacturing group, as announced January 7. The fast-growing chipmaker has earmarked Momentum for oxide and tungsten applications below the 0.14-micron technology node. The 200-mm evaluation expands the integrated circuit (IC) manufacturer's broad portfolio of SpeedFam-IPEC systems to include orbital hard-platen technology and represents one of the original tool placements within SpeedFam-IPEC's global account penetration program for Momentum. SpeedFam-IPEC President and CEO Richard Faubert said, ``We have committed to securing six 200-mm and three 300-mm Momentum evaluations at top-ranking device manufacturers' sites during the current industry downturn. We believe the placement -- and subsequent qualification -- of Momentum for leading-edge technologies will position the company for success during the next upturn when these technologies are implemented in full production.'' There are more than 20 Momentum-based CMP tools currently on order or installed at leading-edge fabs and foundries in the United States, Europe and Asia. The 200-mm system represents the second Momentum evaluation by a European chipmaker. ``Our customer is a respected technology pacesetter with which SpeedFam-IPEC has partnered since 1995,'' said SpeedFam-IPEC Executive Vice President Giovanni Nocerino. ``They selected Momentum after reviewing the results of stringent, head-to-head demonstrations by our company and other CMP equipment suppliers. Their decision to evaluate Momentum is testimony to the productivity and cost-of-ownership advantages of the orbital hard-platen platform. ``At SpeedFam-IPEC, we clearly understand advanced technology trends and their implications for the coming ramp,'' Nocerino continued. ``During the current downturn, leading-edge device manufacturers are assessing critical technologies to help them make key purchasing decisions at both 200 mm and 300 mm. At the upturn, their fabs and foundries will have designed in the equipment best prepared for the demands of volume production. Momentum is on a clear path toward design wins at numerous future-focused device manufacturing sites.'' Faubert concluded, ``Momentum consistently delivers a competitive edge when it comes to lowest cost of consumables and unparalleled yield-enhancing performance metrics that enable next-generation technology nodes. In short, Momentum is the industry's CMP productivity leader.'' SpeedFam-IPEC, Inc. SpeedFam-IPEC, Inc. is a pioneer and innovator in the manufacture of chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, the company enables the development of next-generation integrated circuit technology through its leading-edge polishing systems. SpeedFam-IPEC also markets and distributes parts used in CMP and precision surface processing. With headquarters in Chandler, Ariz., and offices throughout the world, SpeedFam-IPEC is publicly traded on Nasdaq under the symbol SFAM. The company's web site URL is www.sfamipec.com. This press release includes statements that constitute ``forward-looking statements'' within the meaning of the Private Securities Litigation Reform Act of 1995 (the ``Reform Act'') and SpeedFam-IPEC claims the protection of the safe-harbor for forward-looking statements contained in the Reform Act. These forward-looking statements are often characterized by the terms ``may,'' ``believes,'' ``projects,'' ``expects,'' or ``anticipates,'' and do not reflect historical facts. Specific forward-looking statements contained in this press release include, but are not limited to: (i) SpeedFam-IPEC's commitment to securing a number of product evaluations at top-ranking device manufacturers' sites during the industry downturn; (ii) SpeedFam-IPEC's belief that the placement and qualification of its product will position the company for success during the next upturn; and (iii) SpeedFam-IPEC's assertion that the product is poised to capture design wins at various sites in the future. Forward-looking statements involve risks, uncertainties and other factors that may cause actual results, performance or achievements of SpeedFam-IPEC to be materially different from those expressed or implied by such forward-looking statements. Factors that could affect SpeedFam-IPEC's results and cause them to materially differ from those contained in the forward-looking statements include risks set forth in SpeedFam-IPEC's filings with the SEC, including the Annual Report on Form 10-K filed on August 24, 2001 and the Quarterly Report on Form 10-Q filed on January 11, 2002. Forward-looking statements speak only as of the date the statement was made. SpeedFam-IPEC does not undertake and specifically declines any obligation to update any forward-looking statements. -------------------------------------------------------------------------------- Contact: SpeedFam-IPEC, Inc. Tamara M. Berry, 480/705-2473 (Marketing Communication) tberry@sfamipec.com Lisa Lyscio, 480/705-2119 (Investor Relations) llyscio@sfamipec.com