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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (59981)	2/5/2002 12:44:34 AM
From: StanX Long	Read Replies (1) \| Respond to of 70976

TI targets 0.09-micron process for production by mid-2003 Transistors measure as small as 37 nm in next-generation logic technology Semiconductor Business News (02/04/02 13:25 p.m. EST) siliconstrategies.com DALLAS -- Texas Instruments Inc. today announced plans to launch a 0.09-micron logic process into production in the middle of 2003. The technology supports up to nine layers of copper interconnect and will produce than 400 million transistors on a chip, said TI. The Dallas-based company said its next-generation CMOS logic process features transistors as small as 37 nm (0.037 micron). TI plans to make available a low-power ASIC design library for the 0.09-micron (90-nm) process by the end of March. A high-performance design library is slated to be available in the third quarter of 2002, as TI prepares for the initial production runs by mid-2003.