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To: wanna_bmw who wrote (158813)	2/14/2002 5:50:30 PM
From: ptanner	Read Replies (2) \| Respond to of 186894

wbmw, re: "Apparently, it's pretty easy to destroy the core of the ceramic package." I will be a little more careful! re: "I seriously doubt that the MP silicon is at all different from the XP silicon. What could there possibly be, then, that would prohibit DP capability in "some" of the XP units, but not all. Haven't tests shown that you can use the Athlon XP in dual CPU systems?" Based on what I gave read the only difference is that MP will work in 2P but XP only might work in 2P. From web articles, it seems most XPs work. However, the premium for MP processors is only $50 (list) and if you really need a 2P system this would be a small price. I tried unsuccessfully to find some definitive answers at AMD's web site on the XP vs MP (other than the official 2P support). re: "If someone is going to complain about Intel selling their mobile CPUs for a premium, maybe they ought to investigate whether AMD has any right to sell the Athlon MP for a premium over the Athlon XP." I know this wasn't directed at me... but what is wrong with selling something for a premium even if the only difference is a label and perhaps enabling/not disabling a feature like PowerNow or Speedstep? AMD sell's its mobile Duron and Athlon chips for a premium. -PT

To: wanna_bmw who wrote (158813)	2/14/2002 6:08:28 PM
From: Joe NYC	Respond to of 186894

wbmw, I used to visit some of the overclocker forums, and the brittle AMD ceramic packaging was a big problem for many users who like to install custom heat sinks. Apparently, it's pretty easy to destroy the core of the ceramic package. The organic one is supposed to be better. The problem were mostly some of the offending heatsinks that did not follow AMD's spec. Athlon CPUs have 4 rubber feet, and HS is supposed to be square, and sit on top of these rubber feet. They provide stability, and prevent pressure on edges. At about the time of Thunderbird release, some heatsinks (thermaltake ?) came to fashion. THese are the cylindrical shaped ones with the fan on the inside. Anyway, the contact area of this heatsink was small. It did not sit on top of the stabilizing feet, and it was reasonably simple to put pressure on one side and chip the ceramic package. These heatsinks disappeared quickly, and newer models have larger base. Joe