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To: Elmer who wrote (159173)	2/18/2002 4:51:18 PM
From: Dave	Respond to of 186894

Elmer, Don't focus on the abstract; focus on the claims. Here's the one which I think you were referring to.. To me, it appears to be obvious, but I know very little about chip manufacture... I would venture to say that the "controller" limitation is the so-called "inventive" step 1. A test socket for connecting a semiconductor package having a non-pin grid array to a circuit board, comprising: a plurality of solder pads, wherein the solder pads are positioned to be aligned with corresponding leads from the non-pin grid array of a semiconductor package; a plurality of corresponding internal leads for connecting the plurality of solder pads to a plurality of leads on the bottom surface of the test socket; at least one guide pin aligning a hydraulic cylinder with the test socket to allow the hydraulic cylinder to press the semiconductor package against the test socket in an aligned manner; and a controller controlling the hydraulic cylinder so that the pressure applied by the hydraulic cylinder does not result in damage to the leads of the semiconductor package.