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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61383)	3/4/2002 10:53:01 PM
From: StanX Long	Read Replies (1) \| Respond to of 70976

LSI Logic, ACM collaborate on CMP replacement in copper processes Semiconductor Business News (03/04/02 15:35 p.m. EST) siliconstrategies.com MILPITAS, Calif. -- LSI Logic Corp. today said it plans to work with ACM Research Inc. in nearby Fremont to become the first chip maker to incorporate the startup's "stress-free polishing" tool in 90-nm (0.09-micron) processes for ICs with copper and low-k dielectric interconnections. ACM Research's electropolishing technology use electrical current to locally control the removal of copper metal across wafer surfaces during process steps normally performed by chemical mechanical planarization (CMP). Electropolishing eliminates stresses to interconnect layers that occur with polishing in CMP tools, according to ACM Research, which first disclosed its technology 16 months ago at Semicon Southwest