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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61385)	3/4/2002 10:56:20 PM
From: StanX Long	Read Replies (1) \| Respond to of 70976

European EUV program targets 'operational' tool by early 2004 By Mark LaPedus Semiconductor Business News (03/04/02 17:05 p.m. EST) siliconstrategies.com SANTA CLARA, Calif. -- An R&D organization from France here today announced major plans to combine its resources with a separate group from Germany and Holland to accelerate development of extreme ultraviolet (EUV) technology for next-generation lithography (NGL). The combined entity from the various European nations will pool their resources and develop an "operational" EUV tool by the end of 2003 or early 2004, according to one of the members of the new group, ASML Holding N.V. of the Netherlands. The Dutch-based company hopes to beat its competitors to the punch in EUV technology. Two separate tools are also being developed by Japanese lithography rivals Canon Inc. and Nikon Corp., according to industry analysts. Meanwhile, the combined France-Germany-Holland effort will not only develop extreme ultraviolet exposure systems, but also EUV-basedblank photomasks, laser sources, and metrology tools, said Jean-Charles Guibert, strategic program manager within the Micro- and Nanotechnologies Innovation Center at France's Leti laboratories.