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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61494)	3/6/2002 3:35:16 AM
From: StanX Long	Read Replies (1) \| Respond to of 70976

Trikon Delivers Planar 300 CVD System to Major Foundry in Taiwan -- Business Wire, 3/5/2002 e-insite.net ORION(TM) 2.2 ultra low k dielectric to be evaluated for copper dual damascene processing at 0.10 micron in 300mm production fab Trikon Technologies, Inc. (Nasdaq NMS: TRKN) today reported that it has shipped a Planar 300(TM) system for installation at the 300mm production facility of a major foundry in Taiwan. The Planar 300(TM) will be used to evaluate Trikon's ORION(TM) 2.2 CVD (chemical vapor deposition) ultra low k film for next-generation copper damascene 0.10 micron logic devices. "This Taiwanese foundry is at the leading edge of semiconductor process development and manufacturing excellence," said Nigel Wheeler, president and chief executive officer. "I am very proud that they will be working with Trikon's Orion(TM) 2.2 ultra low k technology in development of their next generation devices. This represents a huge opportunity for Trikon to demonstrate its capabilities at the highest level and greatly increases Trikon's chances of low k equipment sales into a market Dataquest has forecast to be $ 1.174 billion in 2005 driven by the ramp up in 90nm production volume." "Trikon's Orion(TM) 2.2 is of great interest because it offers the best film properties and the lowest dielectric constant of any CVD insulator presently on offer," said John Macneil, vice president of technology. "Ultra low k materials (with a dielectric constant of less than 2.4) will be introduced as devices shrink below the 100nm technology node to meet ever increasing device speed requirements for the next generation of information management and communications devices."