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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (73781)	3/6/2002 7:29:00 PM
From: Petz	Read Replies (1) \| Respond to of 275872

Hmmm, might explain why the announced capacity didn't change although clean room space [presumable] did. Petz

To: Joe NYC who wrote (73781)	3/7/2002 10:49:44 AM
From: semiconeng	Read Replies (1) \| Respond to of 275872

Could this be the real reason for the Dresden fab expansion? AMD did not know at the time of the construction that their next process will have 9 layers of metal, and when it became clear, AMD expanded the clean room to make room for the additional tools? Joe That makes more sense to me than the assumption for awhile that it had something to do with "Oxygen Implanters". Implant has a relatively small role, as it is mostly used to create the N-Type and P-Type regions. I thought the "Implanter Theory" was a bunch of baloney, but I didn't have another reason for the expansion. And I've found that on the 2 threads I'm involved in, if you want to debunk someone else's assumption, you better have another reason, otherwise you get ripped apart. I didn't have another reason, and I no longer have the patience to get crapped on around here (or there), so I kept my mouth shut. 3 Additonal Metal Layers is a different story. Almost every layer requires Litho, and Metal does for sure. In order to keep the Fab throughput the same while adding additional Layers, I would guess that you would almost certainly not only need additional Litho Tools, but also additional Registration tools to align the current layers to the prevous ones, additional Scanning Electron Microscopes to check the Critical Dimensions, additional Defect Metrology Tools to check for defects on those layers, not to mention additional tools to lay the metal itself. Makes sense to me that you'de need additional Fab space for additional tools, eh? :-) Semi