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To: semiconeng who wrote (73934)3/7/2002 5:43:57 PM
From: hmalyRead Replies (1) | Respond to of 275872
 
Semicongeng Re...Some small die can fit 3/4/5/6 die on a Mask, some larger die can only fit 1/2. <<<<<<

How large is the chrome pattern then. A 10" per side pattern would yield a 1 sq. inch pattern on the wafer, if I read you right.

<<<<I've never seen a Mask that can shoot a whole wafer. Imagine the complexity required to create that mask!<<<<<<<<<<<

That it would be, but with these small sizes, I thought that the ability to line up the die to within a hundred thousanth of an inch (or whatever)on 9 different passes, for each die and multiplying it by the die/wafer would be worse. Secondly, I was thinking that Intel's big production savings on the 300 mm wafers came from the ability to shoot more die each time. However, if the machines can only do, say, 2 die per stepping, then only the amount of setup time to change the wafers would be shortened. Would that by itself save 30% on production costs?