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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61717)	3/8/2002 12:46:08 AM
From: StanX Long	Read Replies (1) \| Respond to of 70976

California Micro Devices Signs Foundry Pact with ASMC Online staff -- Electronic News, 3/7/2002 e-insite.net California Micro Devices Corp. (CAMD) today announced a foundry agreement with Advanced Semiconductor Manufacturing Corp. (ASMC) of Shanghai. The wafer supply agreement establishes ASMC as a manufacturing site for CAMD’s application specific integrated passive (ASIP) devices and analog semiconductors. Financial details were not disclosed. ASMC runs two fab lines in Shanghai, a 5-inch, class 10 bipolar line and a 6-inch, class 1 CMOS line, with a combined capacity of 480,000 wafers per month. CAMD said it is moving towards a "fab-lite" model to allow it greater flexibility to respond to demand. The company said it has begun transferring its thin film manufacturing processes to ASMC for production of its ASIP product line, and expects this to be complete by the third quarter. ASMC’s CMOS process will be used to produce CAMD’s analog semiconductors. Milpitas, Calif.-based CAMD said it already has a manufacturing facility in Tempe, Ariz. that it plans to restructure. "ASMC’s focused business strategy is well aligned our own," said Robert V. Dickinson, CEO of CAMD, in a statement. "Their robust process technology and commitment to quality make them a good partner for California Micro Devices."