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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61991)	3/13/2002 1:02:14 AM
From: StanX Long	Read Replies (1) \| Respond to of 70976

China chip maker ponders 300mm wafer fab By Jack Robertson EBN (03/12/02 18:55 p.m. EST) siliconstrategies.com SHANGHAI - Hau Hong NEC Electronics Co. Ltd. here has hinted at what was once inconceivable: a Chinese 300mm wafer fab. Toshio Ohta, executive vice president, told EBN Tuesday that the next fab on the Hua Hong NEC roadmap is a 300mm facility, although no decision has been made and no timetable yet set on constructing the plant. The company would also require export approval of the Japanese and U.S. governments for equipment in the 300mm fab. But Hua Hong NEC already knows how it would finance such a pioneering Chinese venture. "We would issue an IPO for public and private placement stock to raise capital, when we decide to go ahead," Ohta said. "We would keep bank financing to a minimum, since we don't want to incur a high debt." The 300mm fab decision is likely to be several years away, as Hua Hong NEC first will equip some vacant space in its existing 200mm wafer facility to ramp up production 50% to 30K wafers a month, Ohta explained.