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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (162562)	3/20/2002 12:13:21 AM
From: burn2learn	Read Replies (1) \| Respond to of 186894

Are the particle defects the ones that cause the most die loss (die impact)? I thought the 300mm wafers were in FOOP's and isolated from humans, very different from 200mm. Does that mean the majority of particles are tool related and not environmental? Does TSMC have the same "mechanism's" as Intel? Your 70% is based on a X wafer size, is there a shift or change in % due to wafer size, are other defects of more concern at 300mm? Since you have less wafers with more die are you now heavily impacted by excursions? I was not around for the 6" to 8" conversion...I would like to hear from some that were, I'm sure the concerns were the same. When I read the article I got the impression that it was written from someone not really involved or just was introduced to a new technology and trying to comprehend initial thoughts on the differences in what maybe he had seen in the past. I was surprised to see the title of the author.