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To: Elmer who wrote (75603)3/26/2002 10:50:43 AM
From: Ali ChenRespond to of 275872
 
"I would add that the defect density number is measured at wafer sort and is primarily based on particulates. Assuming proper process control..."

So, what is it, is it measured, or "based" on some
assumptions, "number of particulates"?

I think that test technicians and even most "engineers",
some with Ph.D, may not realize, due to lack of
general education and publicly demonstrated lack of
certain thinking skills, that when oxide thickness is
approaching just few atomic layers, there is such
a fundamental thingy called "thermodynamic fluctuations",
especially when the number of devices is of the order
of 10^7 and growing...
Therefore the assumption about "proper process control"
may be very improper, and may never materialize for
ever shrinking feature size technologies.

"Eventually they'll realize what is meant by bad yields."

It is very easy: bad yields are when 5 fabs cannot
satisfy demand of a down market. Clear and sober.

- Ali



To: Elmer who wrote (75603)3/26/2002 11:21:05 AM
From: hmalyRead Replies (2) | Respond to of 275872
 
Elmer Re.... I would add that the defect density number is measured at wafer sort and is primarily based on particulates. <<<<<<<

When is wafer sort done. From a laymans point of view, I would expect that wafer sort is done after slicing and polishing of the wafer, but before any imaging steps, to eliminate any wafers with a bad polish and too high of a particulate density.


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