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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: tcmay who wrote (77910)	4/22/2002 2:19:22 AM
From: Mani1	Read Replies (1) \| Respond to of 275872

Re <<your point about how increasing the heat spreader or slug area will increase thermal resistance makes no sense>> Yes that does not make any sense, but that was never my point. My point is that the addition of the heat slug into the total package ads to the total thermal resistance. If you look at the current Athlon package, you see the bare die is showing. Future plan for AMD is to glue in a lid (or slug) on top of that die. This lid protects the die, but thermaly it does not help since it adds another layer of thermal resistance. Mani

To: tcmay who wrote (77910)	4/22/2002 2:36:17 AM
From: Petz	Read Replies (1) \| Respond to of 275872

tcmay, think of it this way. NO HEAT can escape the die except through the slug. Therefore it is a series thermal resistance. And the larger area of the slug can do no better than having the contact area of the heatsink made of the same high thermal conductivity metal -- at the point where the heatsink contacts the die. Copper faced heatsinks are now common. The heat can spread perfectly efficiently in the transverse direction without adding a resistance-adding spreader to heatsink interface. Petz