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To: tcmay who wrote (77920)	4/22/2002 3:05:10 AM
From: Mani1	Respond to of 275872

This post by John says it nicely. If you still don't get it, then there is nothing I can do. "The heat can spread perfectly efficiently in the transverse direction without adding a resistance-adding spreader to heatsink interface" Message 17363057 BTW, your link does not work for me. Mani

To: tcmay who wrote (77920)	4/22/2002 8:04:16 AM
From: Bill Jackson	Respond to of 275872

Tim, The link works ok, it was just grabbing some follow on text, which broke it. dnp.co.jp There seems to be some truth in what you both say. A heat slug that is larger than the die area will improve heat dissipation(over a heat sink on the die) if it is engineered to be directly bonded to the die with 100% metal to die contact. Possibly a solder could do this as long as it has a higher K than a heat sink compound or glue. In effect it is a built in manufactured somewhat larger heat sink to which you can attach another heat sink with conventional methods. This will protect the die from fractures by bad installation methods as well. This slug will be a high K material. Now since the area of the slug will be a lot larger than the heatsink and it will have a better bond(lower K) to the die it will not add thermal resistance to the package. It will replace a poor path from the bare die to the previous direct heat sink with a better path to the slug. The slug will be larger and thus have a better path to the final heat sink added on. Net result is lower die temperature by replacing the old heat sink to die method with a heat sink to slug to heat sink method, since each of those thermal resistances can be optimized separately. You can even add bolts to the slug so an added heat sink can be tightened down, Alpha style, as long as the slug has it's perimeter bonded to the chip body to stop stress/torque transfer to the die. Bill