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To: hmaly who wrote (78009)4/23/2002 10:59:13 AM
From: Mani1Respond to of 275872
 
Re <<Good explaination and I understand your anology. However barring AMD or Intel putting a HS directly on the die (which would be impossible to meet financial and differing conditions), what else could be done? >>

You use a heat slug, just as Intel has been doing and AMD plans to do. It can be place with a "pick&place" machine and can be glued it with highly filled (usually with boron nitride or silver) epoxy and then baked. The thermal penalty is not significant. It is not as good as a direct attach to a sink/spreader combo, but it is more reliable.

Mani