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To: Bill Jackson who wrote (78013)	4/23/2002 11:28:09 AM
From: pgerassi	Read Replies (1) \| Respond to of 275872

Dear Bill: Do you think that Intel uses the best possible HIS design? Even if it adds $30 to the cost of a package? No, they use a good HIS, but it is not designed to be the best that could be done. And the design of the HSF can make the HIS work worse than not having it at all. The best HSFs currently in use for the AXP are better than the current Intel HIS/best HSF combos. If you think that Intel has the best HIS possible, then you do not know of the various expensive ways to do a much better job. Filling the insides with TFE or another heat transfer fluid, would increase the dissapation and better spread the heat internally within the package. Heck, go for a stable laminar flow of TFE over the die surface and you get a far lower overall thermal resistance. Of course the best would be a superconductor directly attached to the die. The later three are not done, yet are demonstratably better than the current Intel HIS. It forces these solutions until after the package and they would do far better directly attached to the die. If forces Intel's design of a HIS over anyone elses and there are non performance constraints on their HIS that are not needed to be considered by other vendors. And even those that are common to both, Intel's may not be at the price point or performance point used by the other vendors. They may do it for their HSF that they use in their boxed sets. You should know that there are some HSFs by other vendors that significantly beat the performance of the Intel boxed HSF. Intel's HIS is not designed to the performance of those better HSFs. No the HIS has the advantage of stopping ham handed amateurs from cracking the die, but at a price of not being the best method to sink the heat from the die and putting a lower upper bound on performance of any HSF than it would have being direct connected. Pete