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To: Mani1 who wrote (78032)	4/23/2002 4:09:18 PM
From: Bill Jackson	Respond to of 275872

Mani, I assume the spreader is soldered on with low temp solder and this thin metallic interface will be better than a HS compund. Since solder is low in viscosity it will make a very thin film under low pressure. Compounds need higher viscosity to stay resident and thus are harder to squeez thin, esp with high loadings if silver or other conductor. Thus they will be able to make the two added together be better than one with paste to die. If they use a glue that goes hard and is very thin, but is still not metallic...intermediate solution, thin, but no metal. A metal filled compunds gets hard to squeeze to a thin shape. bill