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To: pgerassi who wrote (78118)	4/23/2002 10:06:29 PM
From: Bill Jackson	Read Replies (1) \| Respond to of 275872

Pete, not possible to solder spreader to die? I would have thought that would be possible with lower temp alloys to stay within tolerance of the Si die. There is also the differential thermal expansion, so it would have to match that. Paste has enough give to avoid that. A filled epoxy would be too viscous to squeeze very thin at high loading. At low loading there would be too muc organic content for good thermal K. a fluid inside would help, but it would need to be low viscosity for fast turnover as it convects. Does anyone know how they do it? Bill