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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: pgerassi who wrote (78306)	4/24/2002 10:42:17 PM
From: Bill Jackson	Respond to of 275872

Pete,Well, you have pads on the substrate as well as on the die and the bumps bridge the gap between them. On the die the pads must be smaller than on the substrate. 10 per square MM is certainly a high density. Gives you an idea of the precision needed. pr.fujitsu.com *2 Flip-chip: A mounting technique in which the chip is inverted and then joined to the circuit board. Solder bumps are applied to either the chip or the circuit board at this point, and the chip is joined with the board through these bumps. Bill