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To: Tony Viola who wrote (164585)4/25/2002 1:01:06 PM
From: wanna_bmw  Read Replies (1) | Respond to of 186894
 
Tony, Ron is talking about flash, now. It appears that Intel is moving towards their 3rd generation multi-layer cell technology, while the competition still hasn't released their 1st gen. Intel's is shrinking in cell size, and leads in process technology.

Also, die per wafer accelerates with multi-layer tech. 1-bit/cell on .18u yields ~100 die/wafer. Moving to .13u yields 270 d/w, and 2-bit/cell on .13u yields 422 d/w. All for 128mb flash die.

Thirdly, a new "stack" technology allows a piece of flash silicon and a second piece of X-Scale silicon to be "folded" one on top of the other to increase density. Extraordinary.

wbmw