To: kech who wrote (21863 ) 4/26/2002 11:08:03 AM From: JohnG Respond to of 197227 Tom. No -- SAN DIEGO -- April 15, 2002 -- QUALCOMM Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced the on-time sample shipment of the radioOne™ Zero Intermediate Frequency (Zero IF) MSM6000™ chipset solution, including the MSM6000 Mobile Station Modem (MSM™) chipset and system software, RFT6100™, RFR6000™ and RFL6000™ transmit and receive chips, the PM6000™ power management chip, and the accompanying Subscriber Unit Reference (SURF™) development platform. The radioOne MSM6000 chipset leverages the cost advantages of Zero IF with a reduction in cost, component count and Printed Circuit Board area (PCB). Providing backward compatibility and voice-capacity benefits of third-generation (3G) CDMA2000 1X, the MSM6000 is targeted for voice- and Short Message Service (SMS)-centric handsets. AND SAN DIEGO -- April 15, 2002 -- QUALCOMM Incorporated (Nasdaq: QCOM), pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology today announced the on-time sample shipment of the world’s first Zero Intermediate Frequency (Zero IF) radioOne™ MSM6050™ chipset solution for third-generation (3G) CDMA2000 1X mobile devices. Leveraging the advantages of Zero IF, which include reductions in cost, component count and Printed Circuit Board area (PCB), the samples of the complete system solution consist of the MSM6050 Mobile Station Modem (MSM™) chipset and system software, RFT6100™, RFR6000™ and RFL6000™ transmit and receive chips, PM6050™ power management chip, and the accompanying Subscriber Unit Reference (SURF™) development platform. The radioOne MSM6050 chipset delivers a cost-effective solution for next-generation devices designed to take advantage of the worldwide growth and success of 3G CDMA2000 1X networks and address the growing demand for position location capabilities, and data applications and services.