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To: wanna_bmw who wrote (79182)	5/3/2002 2:15:28 AM
From: ptanner	Respond to of 275872

wbmw, re: "some chipset designers will make the die size intentionally larger in order to decrease the thermal density" I thought another reason that small size is not as desirable is the pinouts? For higher value products this would be less of a concern. I recall this was mentioned as one of the reasons Micron put L3 on a Northbridge (extra die space). WRT die size vs package I used the best values I could find. IIRC the northbridge on my KT133A motherboard was considerably larger than the TBird it hosts. Still, the values are all much larger than first estimated. The i845 NB has quite a cooling solution (high force clamp and large heatsink) in Intel's docs though it dissipates only about 6W. Is there a fan on your new system's NB? -PT