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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Road Walker who wrote (165030)	5/10/2002 12:51:22 PM
From: tcmay	Read Replies (1) \| Respond to of 186894

"re: When will reporters learn that "assembly and test" is not the same thing as "building"? "Actually, to normal folks (non-engineers), "assembly and test" is "building". When you "build" a house, for instance, you don't manufacture the components on site." All the more reason for journalists to do their job and educate the yahoos (TM, the Yahoo Corporation, all rights reserved). The difference between making a wafer and packaging the chips is easy enough to explain. "But I know what you mean, the real work is done elsewhere. And the fact that Intel is using China for the non-fabrication process is not a big deal." Yes, not a big deal that Intel uses Asian sites, as they have for 30 years. Big news would be a wafer fab in China, which is what I thought the headline was referring to...turns out to be just another assembly and test site in Asia. "Is there some kind of Intel shareholder holiday? Not many posts on the thread recently." Several posters have been banned by the Maniban and some of us have gotten warning letters from SI. I assume we're not pumping AMD and Infospace up enough. I am working on a "AMD will go to the moon! Infospace is our Top Pick" Blodgett-style puff piece. Maybe this will get me back in the good graces of the Manitollah. --Tim May

To: Road Walker who wrote (165030)	5/11/2002 9:07:56 AM
From: semiconeng	Respond to of 186894

Actually, to normal folks (non-engineers), "assembly and test" is "building". When you "build" a house, for instance, you don't manufacture the components on site. --- And even that is a little bit of a grey area. I mean.... Does intel consider the Process of "building" the C4 Bumps for the Flip Chip Packaging to be part of the "Fab" Process, or the "Assembly" Process. It could be argued that since the Bump Process uses several of the Manufacturing Fab Tools, and and since the Solder Bumps ARE built on the wafer die pads, not on the package, that, Assembly IS in fact "building" on the wafer, to some extent. Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging: intel.com Semi