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To: burn2learn who wrote (80422)5/21/2002 3:53:18 PM
From: ElmerRespond to of 275872
 
maybe it's both. due to the tighter fabrication process requirements (for example .13node poly line uniformity) and the aggressive targets (small poly line)it has a greater impact on die yield than DD. They could be losing 20-40 die per wafer due to defects but now lose 30-50 due to litho loss for example.

I'm glad you mentioned this, it's a possibility as well. No matter what the reason, their Fab doesn't produce nearly as many processors as it is theoretically capable of.

EP


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