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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: Jim Oravetz who wrote (977)	5/31/2002 7:15:37 AM
From: Jim Oravetz	Read Replies (1) \| Respond to of 1056

Amkor Orders 65 Wire Bonders from K&S Online staff -- Electronic News, 5/30/2002 Kulicke & Soffa Industries Inc. today said Amkor Technology Inc. has ordered 65 wire bonders. K&S said the order illustrates the strengthening demand for fine pitch packages. The order follows a February announcement, when Amkor said it intended to purchase 200 of K&S’s Maxum ultra fine pitch ball bonders. The devices are necessary for Amkor’s fine pitch packaging roadmap, as it intends to manufacture advanced ball grid array (BGA) packages for a range of end market applications. The 65 8028-PPS ball bonder machines are rated at 50-micron pad pitch capability and delivery will be complete by the end of June, K&S said. These will be delivered to Amkor’s assembly facilities in Japan, Korea and Taiwan. The remaining 200 45-micron Maxum bonders are expected to be ordered and delivered later this year. "K&S is working closely with Amkor to meet its current and next-generation interconnect requirements and to help increase Amkor's competitive position in advanced packaging technology," said Jack Belani, K&S’s VP of marketing, in a statement.